OPS BOX PC

OPS BOX PC
Details:
AOS-SOR39232H OPS plug-in modular installation
ARM ROCKCHIP SOC package RK3399 6-core CPU
3 groups of USB2.0, 1 group of USB3.0
Gigabit Ethernet port (dual Ethernet port optional)
support asynchronous optional dual display (HDMI+HDMI)
Support TF card expansion Max.64G, HDMI input function ,
Android7.1/Android9.0/10.0 /Ubuntu/Deepin/ Linux OS ,
Size:180mm (L) x 195mm (W)x 42mm(H) ,
Products comply with CE FCC ROHS regulations
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Description
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RK3399 HDMI 4K Extensible Display OPS-C Computer Support TF

What is an OPS Box PC?

 

From the perspective of industry application adaptation, the OPS box PC offers significant advantages in deployment and maintenance, meeting the needs of multiple sectors. During deployment, it adheres to open pluggable specifications, with standard interfaces that can directly connect to display devices such as electronic whiteboards and query terminals, eliminating the need for custom modifications. This shortens installation cycles and reduces construction costs. Maintenance is modular, independent of the display terminal. In the event of a hardware failure, the entire system can be replaced without disassembling. Functionality can be quickly restored by replacing the faulty OPS box PC unit, reducing downtime and improving operational efficiency. This feature is particularly well-suited for sectors such as education and retail, where device availability is paramount. Whether it's school teaching, shopping mall cashiers, or hospital inquiries, it can deliver stable performance.

 

RK3399 HDMI 4K JAE 80 Pin Interactive Touch Display OPS-C Computer Support TF  (5)

 

RK3399  Conference Meeting HDMI 4K Display OPS-C Computer Support TF

 

Specification

 

Processor

CPU

ARM ROCKCHIP RK3399

Chipset

SOC

Memory

Capacity

2GB SO-DIMM DDR3 1333 MHz memory , Max.4GB

Storage

EMMC

TF Card

M.2

32G, Max.64GB

Supports 64G

Supports 128G

Display

Graphics chip

Output

CPU integrated graphics HD Graphics

VGA+HDMI Single/dual display (same/asynchronous display)

1 ×HDMI (Max. resolution:1920x1080)

1 ×HDMI (Max. resolution:3840x2160)

Function

 

MINI PCIE
COM port

Amplifier

1X MINI PCIE(3G/4G)

1X RS232

5W

Ethernet

Chip

WIFI

1 × RTL8211E 10/100/1000M(RJ45 LAN)Optional dual network ports

1 x AP6356S positive base WIFI 2.4G/5G dual-mode +BT

I/O

USB 2.0

USB 3.0

IR

Power button

Reset

OPS interface

LED light

DC JACK

Audio

3× USB2.0(Max. 3)

1x USB3.0

1X IR infrared

1 × power button

1 × upgrade

1 × OPS interface(80pin)

1 x LED light

1 × DC JACK

1 × LINE-OUT & MIC-IN

Integrated 6-channel sound ALC662 sound card chip

Power

Input

Rated power

DC 12~19V

20W

Physical parameters

Dimensions

180mm (L) x 195mm (W)x42mm(H)

Environment

Temperature

Humidity

Working temperature:0°C ~50°C Storage temperature:-20~70°C

5%~90% No condensation

Operating system

Vision

Android 7.1/10.0 Linux

 

RK3399 HDMI 4K  2G 4G RAM 32G 6G ROM OPS-C Computer Support TF

 

RK3399 HDMI 4K Classroom Training Center OPS-C Computer Support TF

 

 

How does the OPS computer perform in gaming?

 

The CPU (central processing unit) of an Android device is the core component that determines the device's operating smoothness, multitasking capabilities, and power consumption. Currently, mainstream chips mainly come from manufacturers such as Qualcomm, MediaTek, Huawei HiSilicon, and Samsung Exynos, each with its own performance advantages.

Qualcomm's Snapdragon series is a "regular visitor" in the Android camp. The flagship Snapdragon 8 Gen3 adopts a 4nm process and is equipped with an architecture combination of 1 3.3GHz Cortex-X4 super core, 5 3.0GHz Cortex-A720 large cores and 2 2.0GHz Cortex-A520 small cores. It can not only easily handle the high-definition operation of large mobile games such as "Genshin Impact" and "Honkai Impact 3rd", but also improve graphics processing efficiency through the Adreno 750 GPU. At the same time, it supports high-speed connections such as Wi-Fi 7 and Bluetooth 5.4, adapting to the all-round needs of Android flagship phones; the mid-to-low-end Snapdragon 7s Gen2 and Snapdragon 695 are characterized by balanced power consumption, which meets daily scenarios such as video browsing, social networking, and light games. They are common choices for Android phones priced around 1,000 yuan.

MediaTek's Dimensity series has performed well in recent years. The Dimensity 9300 adopts an all-large core architecture (4 3.25GHz Cortex-X4 + 4 2.0GHz Cortex-A520). With TSMC's 4nm process and Mali-G720 GPU, it has outstanding advantages in multi-core performance and energy efficiency. Equipped with MediaTek's self-developed HyperEngine 6.0 game engine, it can intelligently optimize game frame rate and network stability, becoming the "performance leader" of many Android flagship phones; mid-range chips such as Dimensity 8200 and Dimensity 7020 are known for their high cost performance, support 120Hz high refresh screen, 5G dual-SIM dual-pass, and adapt to the mainstream needs of mid-range Android models.

Huawei's HiSilicon Kirin series (such as the Kirin 9000S) is deeply optimized for the Android ecosystem. It adopts 1 3.0GHz Cortex-X2 super core, 3 2.6GHz Cortex-A710 large cores and 4 2.0GHz Cortex-A510 small core architecture, combined with Huawei's self-developed NPU (neural network processing unit), and performs excellently in the collaboration of AI computing power, image processing and Harmony system (adaptable to some Android devices). It also supports 5G dual-mode full network access, meeting users' demand for domestic chips and comprehensive performance.

Ordering information

 

Sales Model

Specification

AOS-SOR3928H

RK3399 1.8GHz 2G Memory 8G EMMC

AOS-SOR39232H

RK3399 1.8GHz 2G Memory 32G EMMC

AOS-SOR39464H

RK3399 1.8GHz 4G Memory 64G EMMC

 

 

Areas of application

 

Suitable for education, restaurants, hotels, shopping malls, company meetings, public affairs and other areas.

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