
What is an OPS Box PC?
From the perspective of industry application adaptation, the OPS box PC offers significant advantages in deployment and maintenance, meeting the needs of multiple sectors. During deployment, it adheres to open pluggable specifications, with standard interfaces that can directly connect to display devices such as electronic whiteboards and query terminals, eliminating the need for custom modifications. This shortens installation cycles and reduces construction costs. Maintenance is modular, independent of the display terminal. In the event of a hardware failure, the entire system can be replaced without disassembling. Functionality can be quickly restored by replacing the faulty OPS box PC unit, reducing downtime and improving operational efficiency. This feature is particularly well-suited for sectors such as education and retail, where device availability is paramount. Whether it's school teaching, shopping mall cashiers, or hospital inquiries, it can deliver stable performance.


Specification
|
Processor |
CPU |
ARM ROCKCHIP RK3399 |
|
Chipset |
SOC |
|
|
Memory |
Capacity |
2GB SO-DIMM DDR3 1333 MHz memory , Max.4GB |
|
Storage |
EMMC TF Card M.2 |
32G, Max.64GB Supports 64G Supports 128G |
|
Display |
Graphics chip Output |
CPU integrated graphics HD Graphics VGA+HDMI Single/dual display (same/asynchronous display) 1 ×HDMI (Max. resolution:1920x1080) 1 ×HDMI (Max. resolution:3840x2160) |
|
Function
|
MINI PCIE Amplifier |
1X MINI PCIE(3G/4G) 1X RS232 5W |
|
Ethernet |
Chip WIFI |
1 × RTL8211E 10/100/1000M(RJ45 LAN)Optional dual network ports 1 x AP6356S positive base WIFI 2.4G/5G dual-mode +BT |
|
I/O |
USB 2.0 USB 3.0 IR Power button Reset OPS interface LED light DC JACK Audio |
3× USB2.0(Max. 3) 1x USB3.0 1X IR infrared 1 × power button 1 × upgrade 1 × OPS interface(80pin) 1 x LED light 1 × DC JACK 1 × LINE-OUT & MIC-IN Integrated 6-channel sound ALC662 sound card chip |
|
Power |
Input Rated power |
DC 12~19V 20W |
|
Physical parameters |
Dimensions |
180mm (L) x 195mm (W)x42mm(H) |
|
Environment |
Temperature Humidity |
Working temperature:0°C ~50°C Storage temperature:-20~70°C 5%~90% No condensation |
|
Operating system |
Vision |
Android 7.1/10.0 Linux |


How does the OPS computer perform in gaming?
The CPU (central processing unit) of an Android device is the core component that determines the device's operating smoothness, multitasking capabilities, and power consumption. Currently, mainstream chips mainly come from manufacturers such as Qualcomm, MediaTek, Huawei HiSilicon, and Samsung Exynos, each with its own performance advantages.
Qualcomm's Snapdragon series is a "regular visitor" in the Android camp. The flagship Snapdragon 8 Gen3 adopts a 4nm process and is equipped with an architecture combination of 1 3.3GHz Cortex-X4 super core, 5 3.0GHz Cortex-A720 large cores and 2 2.0GHz Cortex-A520 small cores. It can not only easily handle the high-definition operation of large mobile games such as "Genshin Impact" and "Honkai Impact 3rd", but also improve graphics processing efficiency through the Adreno 750 GPU. At the same time, it supports high-speed connections such as Wi-Fi 7 and Bluetooth 5.4, adapting to the all-round needs of Android flagship phones; the mid-to-low-end Snapdragon 7s Gen2 and Snapdragon 695 are characterized by balanced power consumption, which meets daily scenarios such as video browsing, social networking, and light games. They are common choices for Android phones priced around 1,000 yuan.
MediaTek's Dimensity series has performed well in recent years. The Dimensity 9300 adopts an all-large core architecture (4 3.25GHz Cortex-X4 + 4 2.0GHz Cortex-A520). With TSMC's 4nm process and Mali-G720 GPU, it has outstanding advantages in multi-core performance and energy efficiency. Equipped with MediaTek's self-developed HyperEngine 6.0 game engine, it can intelligently optimize game frame rate and network stability, becoming the "performance leader" of many Android flagship phones; mid-range chips such as Dimensity 8200 and Dimensity 7020 are known for their high cost performance, support 120Hz high refresh screen, 5G dual-SIM dual-pass, and adapt to the mainstream needs of mid-range Android models.
Huawei's HiSilicon Kirin series (such as the Kirin 9000S) is deeply optimized for the Android ecosystem. It adopts 1 3.0GHz Cortex-X2 super core, 3 2.6GHz Cortex-A710 large cores and 4 2.0GHz Cortex-A510 small core architecture, combined with Huawei's self-developed NPU (neural network processing unit), and performs excellently in the collaboration of AI computing power, image processing and Harmony system (adaptable to some Android devices). It also supports 5G dual-mode full network access, meeting users' demand for domestic chips and comprehensive performance.
Ordering information
|
Sales Model |
Specification |
|
AOS-SOR3928H |
RK3399 1.8GHz 2G Memory 8G EMMC |
|
AOS-SOR39232H |
RK3399 1.8GHz 2G Memory 32G EMMC |
|
AOS-SOR39464H |
RK3399 1.8GHz 4G Memory 64G EMMC |
Areas of application
Suitable for education, restaurants, hotels, shopping malls, company meetings, public affairs and other areas.
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